'23 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2023) 발표
- 다물리 시스템 및 해석공학 연구실
- 조회수203
- 2023-11-17
2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2023) 구두발표(10.24(화)~10.26(목))를 진행하였습니다.
발표자: 김경빈 석박사통합과정
주제: Modeling Curing Process Using Multi-Physics FEMem Simulation and CNNnn Based U-Net Model
발표자: 박정현 석박사통합과정
주제: Neural Network Based Prediction to Obtain Effective Thermal and Mechanical Property of Semiconductor Package Substrate