2015 IEEE EDAPS
- 와드 유세프
- 조회수1173
- 2015-12-16
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium is the premier international conference in Asia-Pacific region to share the recent progress of modeling, simulation and measurement for the electrical design issues on chip, package and system levels. Covering the paper presentations, industry exhibitions, workshops and tutorials, the EDAPS 2015 will be held in COEX, Seoul, Korea from December 14 to 16, 2015. The technical program of the symposium not only addresses the current technical issues but also brings out the topics on IC design, SiP/SoP packaging, EMI/EMC, EDA tools and most importantly the challenge issues in advanced 3D-IC and TSV design. For further information, please send your inquiry
EMC Professor Wansoo Nah participated in the subject conference.