High-Precise Wafer Transfer Robot
Precise wafer transfer requires compliance with end-effector deflection specifications and dynamic stability during high-speed motion. Mechanical analysis is conducted to satisfy hand deflection specifications for accurate wafer handling, enabling consistent and precise positioning. Control algorithms are developed to minimize tack time by optimizing motion trajectories without compromising accuracy. To ensure wafer stability during transfer, vibration-suppression control strategies are applied during pick-and-place operations, preventing misalignment or damage. The system integrates mechanical design, dynamic modeling, and control logic, targeting reliable, high-throughput performance in semiconductor processes. This project is being carried out in collaboration with industry partners, focusing on the development of core technologies and their verification in real-world environments. Simulation and experimental evaluations are conducted concurrently to assess both mechanical and control effectiveness.
Autonomous Robot System for Vise-Clamping in High-Precision NC Machining
This project aims to fully automate the vise-clamping process in machine tools—a task traditionally performed through human manual labor. To overcome the torque limitations of UR robots, we developed a novel end-effector mechanism in which a pneumatic gripper supports and counteracts the high reaction torque generated during the clamping operation. Additionally, we integrated the wrench tool and robot controller into a unified supervisory system and implemented dedicated algorithms that significantly improve the success rate of wrench insertion and tightening. Through this approach, we achieve complete automation of a process that previously relied heavily on skilled operators and provide an intelligent robotic automation solution applicable to a wide range of manufacturing environments.