2025

[1] J. H. Park, J. Kim, S. W. Jang, S. Mun, E. H. Lee. (2025). “An Effective 3D Thermal Network Integrated With Deep Learning for Improved Prediction of the 3D Thermal Properties of Complex Packaging Patterns". IEEE 75th Electronic Components and Technology Conference (ECTC) (Student Award selected).

[2]  J. U. Lee, H. D. Lee, S. H. Oh, S. H. Park, W. S. Cho, Y. J. Park, A. Haag, S. Watanabe, M. Arnold, H. J. Lee, and E. H. Lee. (2024). “Crystal Plasticity-based Modeling and Experimental Validation of the Influence of Microstructures and Grain boundary Junction Types on the Cu-Cu Bonding Interface". IEEE 75th Electronic Components and Technology Conference (ECTC).

[3] T. H. Kim, and E. H. Lee. (2024). “Multi-physics modeling of dissipation analysis for Lithium-ion batteries". IEEE 24th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm)

2024

[1] S. H. Oh, H. D. Lee, J. U. Lee, S. H. Park, W. S. Cho, Y. J. Park, A. Haag, S. Watanabe, M. Arnold, H. J. Lee, and E. H. Lee. (2024). "Experimental and Numerical Investigation of Cu-Cu Direct Bonding Quality for 3D Integration". IEEE 74th Electronic Components and Technology Conference (ECTC), 1628-1632.

[2] D. W. Jeong, S. Cha, T. H. Kim, W. Gwak, Y. Choi, H. G. An, E. H. Lee. (2024). "Prediction of an industrial framework for semiconductor fabrication and experimental validation of 300 mm wafer". International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2024. 

2023

[1] J. Park, D. Yang, Y. D. Shim, E. H. Lee. (2024). "Eddy Current-Based Monitoring System for Hairpin Coils in Electric Vehicle Motors". IEEE International Conference on Industrial Engineering and Engineering Management, 1498-1501.

2020

[1] K. Y. Kim, S. Park, E. H. Lee, Y. H. Kang. (2020). "An Infrared local heat-treatment method to improve local formability of forming and trimming processes". IOP Conference Series: Materials Science and Engineering, 967 (1), 012033.

[2] K. Lee, C. Hong, E. H. Lee, W. H. Yang. (2020). "Comparison of artificial intelligence methods for prediction of mechanical properties". IOP Conference Series: Materials Science and Engineering 967 (1), 012031.