Publications
2024 [1] S. H. Oh, H. D. Lee, J. U. Lee, S. H. Park, W. S. Cho, Y. J. Park, A. Haag, S. Watanabe, M. Arnold, H. J. Lee, and E. H. Lee. (2024). "Experimental and Numerical Investigation of Cu-Cu Direct Bonding Quality for 3D Integration". IEEE 74th Electronic Components and Technology Conference (ECTC), 1628-1632. [2] D. W. Jeong, S. Cha, T. H. Kim, W. Gwak, Y. Choi, H. G. An, E. H. Lee. (2024). "Prediction of an industrial framework for semiconductor fabrication and experimental validation of 300 mm wafer". International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2024.
2023 [1] J. Park, D. Yang, Y. D. Shim, E. H. Lee. (2024). "Eddy Current-Based Monitoring System for Hairpin Coils in Electric Vehicle Motors". IEEE International Conference on Industrial Engineering and Engineering Management, 1498-1501.
2020 [1] K. Y. Kim, S. Park, E. H. Lee, Y. H. Kang. (2020). "An Infrared local heat-treatment method to improve local formability of forming and trimming processes". IOP Conference Series: Materials Science and Engineering, 967 (1), 012033. [2] K. Lee, C. Hong, E. H. Lee, W. H. Yang. (2020). "Comparison of artificial intelligence methods for prediction of mechanical properties". IOP Conference Series: Materials Science and Engineering 967 (1), 012031.
2018 [1] E. H. Lee, T. B. Stoughton, J. W. Yoon. (2018). "Constitutive modeling and FE implementation for anisotropic hardening under proportional loading conditions". Journal of Physics: Conference Series 1063 (1), 012025. [2] E. H. Lee, S. Ko. (2018). "A study on forming process of AA5083 alloy with an infrared local heat treatment". IOP Conference Series: Materials Science and Engineering 418 (1), 012025
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